Title:
ADHESIVE RESIN COMPOSITION, COVERLAY FILM, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/052376
Kind Code:
A1
Abstract:
Disclosed is an adhesive resin composition containing 100 parts by weight of component (a) which is a polyimide siloxane containing the structural units represented by general formula (1) and (2) (in the formula, Ar represents a tetravalent aromatic group derived from an aromatic tetracarboxylic anhydride, R1 represents a divalent diaminosiloxane residue derived from a diaminosiloxane, R2 represents a divalent aromatic diamine residue derived from an aromatic diamine, and m and n represent the molar ratio of each of the structural units, wherein m is between 0.75 and 1.0, and n is between 0 and 0.25), and 5 to 200 parts by weight of component (b) which is a plate-like inorganic filler, the average particle diameter of which is between 2 and 25µm.
Inventors:
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)
Application Number:
PCT/JP2010/067935
Publication Date:
May 05, 2011
Filing Date:
October 13, 2010
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)
International Classes:
C09J179/08; C09J7/22; C09J7/35; C09J11/04; C09J183/04; H05K3/28
Foreign References:
| JP2002121530A | 2002-04-26 | |||
| JP2009102603A | 2009-05-14 | |||
| JP2004211064A | 2004-07-29 | |||
| JP2005113014A | 2005-04-28 | |||
| JP2003105306A | 2003-04-09 | |||
| JPH05200946A | 1993-08-10 | |||
| JPH0423879A | 1992-01-28 | |||
| JPH06346030A | 1994-12-20 | |||
| JP2000226566A | 2000-08-15 | |||
| JPH07304950A | 1995-11-21 | |||
| JP2009060124A | 2009-03-19 | |||
| JP2003128944A | 2003-05-08 | |||
| JP2009029982A | 2009-02-12 |
Attorney, Agent or Firm:
HOSHIMIYA Katsumi et al. (JP)
Katsumi Hoshimiya (JP)
Katsumi Hoshimiya (JP)
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