ADHESIVE RESIN COMPOSITION AND EASILY PEELABLE FILM

Title:

ADHESIVE RESIN COMPOSITION AND EASILY PEELABLE FILM

Document Type and Number:

WIPO Patent Application WO/2020/195814

Kind Code:

A1

Abstract:

This adhesive resin composition contains: an ethylene-vinyl acetate copolymer (A) having a melt mass flow rate (MFR, JIS K7210:1999, 190°C, 2160 g load) of 5-40 g/10 min. or less and in which the percentage content of a structural unit derived from vinyl acetate is 3-18 mass%; a tackifying resin (B); and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000-300,000 mPa·s as measured by using a Brookfield viscometer at 180°C.

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Inventors:

HASHIMOTO HIDENORI (JP)
OGATA TAKUYA (JP)

Application Number:

PCT/JP2020/010458

Publication Date:

October 01, 2020

Filing Date:

March 11, 2020

Export Citation:

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Assignee:

DOW MITSUI POLYCHEMICALS CO LTD (JP)

International Classes:

C09J11/06; C09J7/35; C09J11/08; C09J123/08; C09J131/04

Foreign References:

JP2002265704A	2002-09-18
JP2009035645A	2009-02-19
JP2009035645A	2009-02-19
JP2019063037A	2019-04-25

Other References: