Title:
ADHESIVE RESIN COMPOSITION AND EASILY REMOVABLE FILM
Document Type and Number:
WIPO Patent Application WO/2022/065151
Kind Code:
A1
Abstract:
This adhesive resin composition comprises an ethylene/vinyl acetate copolymer (A), a linear low-density polyethylene (B) having a melt mass-flow rate (MFR, JIS K 7210:1999, 190°C, 2,160-g load) of 0.01-20 g/10 min, and a tackifier resin (C), wherein the content of the ethylene/vinyl acetate copolymer (A) is higher than 75 mass% but not higher than 95 mass% and the content of the linear low-density polyethylene (B) is higher than 0 mass% but less than 15 mass%, with respect to the whole adhesive resin composition, which is taken as 100 mass%.
Inventors:
YAMAMOTO KOICHIRO (JP)
HASHIMOTO HIDENORI (JP)
OGATA TAKUYA (JP)
HASHIMOTO HIDENORI (JP)
OGATA TAKUYA (JP)
Application Number:
PCT/JP2021/033886
Publication Date:
March 31, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
DOW MITSUI POLYCHEMICALS CO LTD (JP)
International Classes:
B32B27/00; B32B7/06; B65D65/40; C09J7/20; C09J11/08; C09J123/06; C09J123/08; C09J131/04
Domestic Patent References:
| WO2019128320A1 | 2019-07-04 |
Foreign References:
| JP2003238920A | 2003-08-27 | |||
| JPS49111944A | 1974-10-24 | |||
| JP2017008191A | 2017-01-12 | |||
| JP2009035645A | 2009-02-19 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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