Title:
ADHESIVE RESIN COMPOSITION AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/208169
Kind Code:
A1
Abstract:
The present invention relates to an adhesive resin composition characterized by including one or more ethylene-based polymers (A) comprising an ethylene-based polymer graft-modified with an unsaturated carboxylic acid or a derivative thereof and by satisfying requirements (1) to (4). (1) To have a melt flow rate (MFR), as measured in accordance with ASTM D 1238 at a temperature of 190°C and a load of 2,160 g, of 0.1-3 g/10 min. (2) To have a density of 910-930 kg/m3. (3) In examination by crystallization elution fractionation chromatography, the proportion of components eluted at 50°C and lower is 20 mass% or greater. (4) In examination by crystallization elution fractionation chromatography, the proportion of components eluted at 90°C and higher is 25 mass% or greater. The adhesive resin composition of the present invention has excellent adhesive force in application to gas-barrier resins such as ethylene/vinyl alcohol copolymers. Due to this, in a laminate including an adhesive layer comprising the adhesive resin composition and a gas-barrier resin layer in direct contact with the adhesive layer, the two layers have been tenaciously bonded to each other even when, for example, the gas-barrier resin layer contains an additive for softening, and hence separation between the two layers is less apt to occur. Therefore, the laminate can be effectively used as a package, a container, etc. which have high barrier properties.
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Inventors:
IWASHITA AKIHIKO (JP)
OGAWA YOSHIYUKI (JP)
OGAWA YOSHIYUKI (JP)
Application Number:
PCT/JP2019/015117
Publication Date:
October 31, 2019
Filing Date:
April 05, 2019
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09J151/00; B32B27/32; B65D65/40; C09J123/26
Domestic Patent References:
WO1997010297A1 | 1997-03-20 |
Foreign References:
JPH0987603A | 1997-03-31 | |||
JPS61162539A | 1986-07-23 | |||
JPH10316806A | 1998-12-02 | |||
JPH0551496A | 1993-03-02 | |||
JPS6354478A | 1988-03-08 | |||
JPS5968351A | 1984-04-18 | |||
JP2010254968A | 2010-11-11 | |||
JP2011202147A | 2011-10-13 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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