Title:
ADHESIVE RESIN COMPOSITION, METHOD FOR BONDING ADHERENDS, AND ADHESIVE RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2017/137796
Kind Code:
A8
Abstract:
The present invention provides an adhesive resin composition excellent in terms of adhesive strength and durability, a method for bonding adherends, and an adhesive resin film. Specifically, the present invention relates to: an adhesive resin composition characterized by comprising an acid-modified polyolefin resin (A) having a melting point of 50-100ºC, the amount of the resin (A) being larger than 50 parts by mass but not larger than 99.5 parts by mass based on the solid matter, an epoxy resin (B) having a novolak structure, the amount of the resin (B) being 0.5 parts by mass or larger but less than 50 parts by mass based on the solid matter, and an organic solvent (C); a method for bonding adherends which comprises applying the adhesive resin composition to a surface of a first adherend, drying the composition to form an adhesive layer, and thereafter superposing a second adherend on the adhesive layer to bond the adhesive layer to the second adherend; and an adhesive resin film which comprises a first adhesive layer, a base layer, and a second adhesive layer in this order, characterized in that the first adhesive layer and/or the second adhesive layer comprises the adhesive resin composition.
Inventors:
IIZUKA HIROKAZU (JP)
TAKEI KUNIHIRO (JP)
MARUYAMA YUIKO (JP)
SATO YUKI (JP)
TAKEI KUNIHIRO (JP)
MARUYAMA YUIKO (JP)
SATO YUKI (JP)
Application Number:
PCT/IB2016/001741
Publication Date:
September 14, 2017
Filing Date:
December 12, 2016
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
C09J123/26; C09J7/20; C09J7/30; C09J163/04
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