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Title:
ADHESIVE RESIN COMPOSITION AND MOLDED PRODUCTS
Document Type and Number:
WIPO Patent Application WO/2011/129080
Kind Code:
A1
Abstract:
An adhesive resin composition is disclosed for the purpose of providing a hot-melt type adhesive film which enables the production of laminates at low temperature and which exhibits sufficient adhesiveness and heat resistance and excellent workability. The adhesive resin composition comprises, as the essential components, a base resin consisting of (A) 30 to 90 parts by weight of a modified ethylene/olefin copolymer and (B) 70 to 10 parts by weight of a styrene-based thermoplastic elastomer (with the proviso that the total sum of (A) and (B) is 100 parts by weight), and (C) 30 to 60 parts by weight (relative to 100 parts by weight of the base resin) of a tackifier, said modified ethylene/olefin copolymer being an ethylene/olefin copolymer that is graft-modified with (a) an unsaturated carboxylic acid or a derivative thereof and (b) an aromatic vinyl monomer, that contains the component (a) in an amount of 0.1 to 5wt%, and that exhibits, in DSC, a melting point peak with a heat of crystal fusion of 0.5 to 10J/g in a temperature range of 100 to 150°C.

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Inventors:
OKADA YASUNORI (JP)
MATSUMOTO TAKASHI (JP)
MICHINOBU TAKAO (JP)
Application Number:
PCT/JP2011/002095
Publication Date:
October 20, 2011
Filing Date:
April 08, 2011
Export Citation:
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Assignee:
KANEKA CORP (JP)
OKADA YASUNORI (JP)
MATSUMOTO TAKASHI (JP)
MICHINOBU TAKAO (JP)
International Classes:
C09J153/02; B32B25/04; B32B27/32; C08L25/02; C08L53/02; C09J7/00; C09J123/02; C09J151/04
Foreign References:
JP2003002930A2003-01-08
JP2010500450A2010-01-07
JP2006089626A2006-04-06
JP2004292716A2004-10-21
JP2009126922A2009-06-11
Other References:
See also references of EP 2559747A4
Attorney, Agent or Firm:
KANEKA CORPORATION (JP)
KANEKA Co. (JP)
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