ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME

Title:

ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME

Document Type and Number:

WIPO Patent Application WO/2010/098154

Kind Code:

A1

Abstract:

Provided are adhesive resin compositions that are halogen-free, have excellent adhesiveness, solder heat resistance and flame resistance, and excellent flow characteristics, and laminates and flexible printed wiring boards using the same. The resin compositions comprise a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin of 20,000 or greater to 150,000 weight average molecular weight, other thermoplastic resins and a curing agent. The compositions preferably also comprise a benzoxadine compound. Preferably, essentially no inorganic filler is mixed in.

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Inventors:

KAIMORI, Shingo (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
改森　信吾 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)
SUGAWARA, Jun (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
菅原　潤 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)
MIZOGUCHI, Akira (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
溝口　晃 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)

Application Number:

JP2010/050481

Publication Date:

September 02, 2010

Filing Date:

January 18, 2010

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES,LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目５番３３号 Osaka, 〒5410041, JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (30 Hinokigaoka, Minakuchi-cho Kouga-sh, Shiga 68, 〒5280068, JP)
住友電工プリントサーキット株式会社 (〒68 滋賀県甲賀市水口町ひのきが丘３０番地 Shiga, 〒5280068, JP)
KAIMORI, Shingo (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
改森　信吾 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)
SUGAWARA, Jun (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
菅原　潤 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)

International Classes:

C09J163/00; B32B15/08; B32B27/38; C09J7/02; C09J11/06; C09J167/00; C09J171/00; C09J177/00; H05K1/03

Attorney, Agent or Firm:

NAKATA, Motomi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)

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