Title:
ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/098154
Kind Code:
A1
Abstract:
Provided are adhesive resin compositions that are halogen-free, have excellent adhesiveness, solder heat resistance and flame resistance, and excellent flow characteristics, and laminates and flexible printed wiring boards using the same.
The resin compositions comprise a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin of 20,000 or greater to 150,000 weight average molecular weight, other thermoplastic resins and a curing agent. The compositions preferably also comprise a benzoxadine compound. Preferably, essentially no inorganic filler is mixed in.
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Inventors:
KAIMORI SHINGO (JP)
SUGAWARA JUN (JP)
MIZOGUCHI AKIRA (JP)
ASAI SYOUGO (JP)
YOSHISAKA TAKUMA (JP)
UENISHI NAOTA (JP)
SUGAWARA JUN (JP)
MIZOGUCHI AKIRA (JP)
ASAI SYOUGO (JP)
YOSHISAKA TAKUMA (JP)
UENISHI NAOTA (JP)
Application Number:
PCT/JP2010/050481
Publication Date:
September 02, 2010
Filing Date:
January 18, 2010
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
KAIMORI SHINGO (JP)
SUGAWARA JUN (JP)
MIZOGUCHI AKIRA (JP)
ASAI SYOUGO (JP)
YOSHISAKA TAKUMA (JP)
UENISHI NAOTA (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
KAIMORI SHINGO (JP)
SUGAWARA JUN (JP)
MIZOGUCHI AKIRA (JP)
ASAI SYOUGO (JP)
YOSHISAKA TAKUMA (JP)
UENISHI NAOTA (JP)
International Classes:
C09J163/00; B32B15/08; B32B27/38; C09J7/22; C09J7/35; C09J11/06; C09J167/00; C09J171/00; C09J177/00; H05K1/03
Foreign References:
| JP2008239675A | 2008-10-09 | |||
| JP2008231195A | 2008-10-02 | |||
| JP2006045322A | 2006-02-16 | |||
| JP2008231287A | 2008-10-02 | |||
| JP2007314742A | 2007-12-06 | |||
| JP2008055882A | 2008-03-13 |
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
Nakada Motoki (JP)
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