Title:
ADHESIVE SEALING FILM, METHOD FOR MANUFACTURING ADHESIVE SEALING FILM, AND COATING LIQUID FOR ADHESIVE SEALING FILM
Document Type and Number:
WIPO Patent Application WO/2013/031656
Kind Code:
A1
Abstract:
The present invention relates to an adhesive sealing film which contains polyisobutylene with a number-average molecular weight of at least 10,000, and a tackifying resin whose carbon double bond content is between 1.6% and 50.0%. According to the durable adhesive sealing film of the present invention, the polyisobutylene is used as an elastomer for high water barrier characteristics, and the tackifying resin with the predetermined range of the carbon double bond content is used for high adhesiveness. The adhesive sealing film of the present invention has high water barrier characteristics and high adhesiveness at the same time.
Inventors:
NAKADE HIROSHI
YAMAKAWA TOMOKO
ANDO MASATO
OOMORI TAKESHI
UENO NOBUHIKO
YAMAKAWA TOMOKO
ANDO MASATO
OOMORI TAKESHI
UENO NOBUHIKO
Application Number:
PCT/JP2012/071362
Publication Date:
March 07, 2013
Filing Date:
August 23, 2012
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
NAKADE HIROSHI
YAMAKAWA TOMOKO
ANDO MASATO
OOMORI TAKESHI
UENO NOBUHIKO
NAKADE HIROSHI
YAMAKAWA TOMOKO
ANDO MASATO
OOMORI TAKESHI
UENO NOBUHIKO
International Classes:
C08L23/20; C08J5/18; C08L57/02; C08L93/04; C09J7/00; C09J11/08; C09J123/20; H01L51/50; H05B33/04; H05B33/14
Domestic Patent References:
| WO2011062167A1 | 2011-05-26 | |||
| WO2001095411A1 | 2001-12-13 | |||
| WO2005033035A1 | 2005-04-14 |
Foreign References:
| JP2007197517A | 2007-08-09 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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Claims: