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Title:
ADHESIVE FOR SEALING ORGANIC ELECTROLUMINESCENT ELEMENT AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO2003106582
Kind Code:
A8
Abstract:
An adhesive for sealing an organic electroluminescent element which comprises a compound capable of undergoing a light cationic polymerization and a light cationic polymerization initiator, wherein a curing reaction is started by the irradiation with a light and proceeds also after the blockage of a light as a dark reaction; a pressure sensitive adhesive tape for sealing an organic electroluminescent element; a double side pressure sensitive adhesive tape for sealing an organic electroluminescent element; a method for sealing an organic electroluminescent element; and an organic electroluminescent element. The adhesive can be advantageously used for sealing an organic electroluminescent element with no danger of deterioration by light or heat.

Inventors:
SHIMAZU HIRONOBU (JP)
SHICHIRI TOKUSHIGE (JP)
Application Number:
PCT/JP2003/007637
Publication Date:
March 17, 2005
Filing Date:
June 17, 2003
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
SHIMAZU HIRONOBU (JP)
SHICHIRI TOKUSHIGE (JP)
International Classes:
H01L51/52; G03F7/038; (IPC1-7): C09J201/00; C09J163/00; C09J11/06; C09J7/00; C09K3/10; H05B33/04; H05B33/14
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