ADHESIVE FOR SEMICONDUCTOR COMPONENTS

Title:

ADHESIVE FOR SEMICONDUCTOR COMPONENTS

Document Type and Number:

WIPO Patent Application WO/1999/001519

Kind Code:

A1

Abstract:

An adhesive for semiconductor components, comprising as a substrate polymer at least one cyclic thermoplastic polymer having a number average molecular weight of 1,000 to 500,000 and selected from the group consisting of cyclic olefin polymers (a) and aromatic condensation polymers (b) having repeating units of an aromatic ring in the main chain; an adhesive sheet prepared from the adhesive; a semiconductor component package made by using the adhesive ; and a process for preparing the package.

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Inventors:

Kodemura, Junji (Research & Development Center Nippon Zeon Co, Ltd. 2-1 Yako 1-chome Kawasaki-ku, Kawasaki-shi Kanagawa, 210-0863, JP)

Application Number:

PCT/JP1998/003033

Publication Date:

January 14, 1999

Filing Date:

July 06, 1998

Export Citation:

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Assignee:

NIPPON ZEON CO., LTD. (6-1 Marunouchi 2-chome Chiyoda-ku Tokyo, 100-0005, JP)
Kodemura, Junji (Research & Development Center Nippon Zeon Co, Ltd. 2-1 Yako 1-chome Kawasaki-ku, Kawasaki-shi Kanagawa, 210-0863, JP)

International Classes:

C09J9/02; H01B1/20; H01B1/22; H01B1/24; H01L21/60; (IPC1-7): C09J123/26; C09J165/00; C09J171/12; H01B1/20

Attorney, Agent or Firm:

Nishikawa, Shigeaki (Visual City 401 43-8, Higashi-Nippori 3-chome Arakawa-ku Tokyo, 116-0014, JP)

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