Title:
ADHESIVE FOR SEMICONDUCTOR SENSOR CHIP MOUNTING, AND SEMICONDUCTOR SENSOR
Document Type and Number:
WIPO Patent Application WO/2017/155117
Kind Code:
A1
Abstract:
This adhesive for semiconductor sensor chip mounting can reduce noise sensing and can improve heat resistance and thermal cycle resistance characteristics. This adhesive for semiconductor sensor chip mounting is used in semiconductor sensor chip mounting, and contains a silicone resin and a spacer. The 10% compressive elasticity modulus of the spacer is 10-2000 N/mm2, the compression recovery rate of the spacer is less than or equal to 20%, and the average particle diameter is 10-200 μm.
Inventors:
UEDA SAORI (JP)
YAMADA YASUYUKI (JP)
YAMADA YASUYUKI (JP)
Application Number:
PCT/JP2017/009816
Publication Date:
September 14, 2017
Filing Date:
March 10, 2017
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
G01L9/00; C09J11/00; C09J11/08; C09J183/04; H01L29/84
Foreign References:
| JPH11108782A | 1999-04-23 | |||
| JP2012004224A | 2012-01-05 | |||
| JP2015075422A | 2015-04-20 | |||
| JPH10300772A | 1998-11-13 |
Other References:
See also references of EP 3428600A4
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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