Title:
ADHESIVE FOR SEMICONDUCTOR, ADHESIVE SHEET FOR SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209875
Kind Code:
A1
Abstract:
According to the present invention, in a semiconductor device in which a plurality of connection portions of a semiconductor chip and a plurality of connection portions of a wiring circuit board are electrically connected to each other or a semiconductor device in which a plurality of connection portions of each of a plurality of semiconductor chips are electrically connected to each other, an adhesive for a semiconductor used for sealing at least a part of the connection portions electrically connected to each other is disclosed. The adhesive for a semiconductor contains an epoxy resin, a curing agent, a thermoplastic resin, and an inorganic filler. The inorganic filler contains an inorganic filler having an average particle diameter of 100-400 nm, or exhibits at least one peak at the position of the particle diameter of 100-400nm in the particle size distribution obtained when the particle size distribution of the inorganic filler is measured by dynamic light scattering.
Inventors:
MASUNO DAISUKE (JP)
MIYAHARA MASANOBU (JP)
SATO MAKOTO (JP)
CHABANA KOICHI (JP)
MIYAHARA MASANOBU (JP)
SATO MAKOTO (JP)
CHABANA KOICHI (JP)
Application Number:
PCT/JP2022/011736
Publication Date:
October 06, 2022
Filing Date:
March 15, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J7/30; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01L21/56; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| WO2021065518A1 | 2021-04-08 |
Foreign References:
| JP2015137299A | 2015-07-30 | |||
| JP2015129247A | 2015-07-16 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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