Title:
ADHESIVE SET, STRUCTURE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/029045
Kind Code:
A1
Abstract:
One aspect of the present invention is an adhesive set comprising a first liquid that contains a polymerization initiator, and a second liquid that contains a reducing agent, the first liquid and/or the second liquid also containing a monomer that has ethylenic unsaturated groups, the first liquid and/or the second liquid also containing an epoxy resin, and the first liquid and/or the second liquid also containing a curing agent for curing the epoxy resin.
Inventors:
FUJIYASU YOSUKE (JP)
MATSUNAGA MASAHIRO (JP)
OJI MASASHI (JP)
KAWAMORI TAKASHI (JP)
MATSUNAGA MASAHIRO (JP)
OJI MASASHI (JP)
KAWAMORI TAKASHI (JP)
Application Number:
PCT/JP2019/031977
Publication Date:
February 18, 2021
Filing Date:
August 14, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J4/00; C09J11/06; C09J163/00
Foreign References:
| JP2015174885A | 2015-10-05 | |||
| JPH05105862A | 1993-04-27 | |||
| JPH1129748A | 1999-02-02 | |||
| JPH09296027A | 1997-11-18 | |||
| JPH11343465A | 1999-12-14 | |||
| JPH0977849A | 1997-03-25 | |||
| JP2019048952A | 2019-03-28 | |||
| JPH04100878A | 1992-04-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: