Title:
ADHESIVE SHEET, BONDING KIT, BONDED STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/173898
Kind Code:
A1
Abstract:
According to the present invention, an adhesive sheet is sequentially provided with a first adhesive layer, a substrate sheet and a second adhesive layer. At least one of the first adhesive layer and the second adhesive layer is cured by means of a curing agent.
Inventors:
ISHIGURO SHIGEKI (JP)
YOSHIDA AKIKO (JP)
YOSHIDA AKIKO (JP)
Application Number:
PCT/JP2018/010108
Publication Date:
September 27, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; B32B27/00; B32B27/26; C09J5/04; C09J7/26; C09J7/28; C09J163/00
Foreign References:
| JPS6030331A | 1985-02-15 | |||
| JP2000086985A | 2000-03-28 | |||
| JPS5867775A | 1983-04-22 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Download PDF:
Previous Patent: DISPLAY DEVICE AND DRIVE METHOD THEREFOR
Next Patent: NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY
Next Patent: NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY