ADHESIVE SHEET FOR BOTH DICING AND DIE BONDING AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE ADHESIVE SHEET

Title:

ADHESIVE SHEET FOR BOTH DICING AND DIE BONDING AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE ADHESIVE SHEET

Document Type and Number:

WIPO Patent Application WO/2005/109479

Kind Code:

A1

Abstract:

The purposes of this invention are to reduce bonding wire deterioration generated when semiconductor chips are being stacked, and to eliminate variance in semiconductor device heights due to thickness accuracy failure of an adhesive agent layer bonding the semiconductor chips, variance in heights from a board to a surface of the semiconductor chip of the uppermost layer, and inclination of the semiconductor chip of the uppermost layer, in a so-called “stacked type semiconductor device”. An adhesive sheet for both dicing and die-bonding relating to this invention to achieve such purposes of this invention is provided with a base material and an adhesive agent layer peelably stacked on the base material. The adhesive agent layer has pressure sensitive adhesiveness at room temperatures, thermosetting property, an elastic modulus of 1.0×10³-1.0×10⁴Pa prior to thermosetting and a melting viscosity of 100-200Pa/sec at 120°C prior to thermosetting, and it requires a time of 60sec or shorter to permit the melting viscosity to reach the minimum value when the temperature of the adhesive agent layer prior to thermosetting is fixed at 120°C.

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Inventors:

FUKUI YASUKI (JP)
YAMAZAKI OSAMU (JP)
SAIKI NAOYA (JP)

Application Number:

PCT/JP2005/008728

Publication Date:

November 17, 2005

Filing Date:

May 12, 2005

Export Citation:

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Assignee:

SHARP KK (JP)
LINTEC CORP (JP)
FUKUI YASUKI (JP)
YAMAZAKI OSAMU (JP)
SAIKI NAOYA (JP)

International Classes:

C08G59/08; C08G59/32; C08G59/44; C08G59/68; C09J5/00; C09J7/22; C09J7/38; C09J163/00; C09J201/00; H01L21/301; H01L21/52; H01L21/58; H01L21/68; H01L25/065; H01L25/07; H01L25/18; H01L21/00; (IPC1-7): H01L21/301; C09J7/02; C09J163/00; H01L21/52

Foreign References:

JP2004072009A	2004-03-04
JP2004099833A	2004-04-02
JP2002158239A	2002-05-31
JPH09100450A	1997-04-15

Other References: