Title:
ADHESIVE SHEET FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/137443
Kind Code:
A1
Abstract:
Disclosed is an adhesive sheet for connecting a circuit member, which comprises a supporting base and an adhesive layer that is provided on the supporting base and composed of an adhesive composition. The adhesive composition contains (A) a high molecular weight component having a weight average molecular weight of not less than 100,000, (B) an epoxy resin, (C) a phenolic epoxy resin curing agent, (D) a radiation polymerizable compound, (E) a photoinitiator and (F) a curing accelerator.
Inventors:
OOKUBO KEISUKE (JP)
NAGAI AKIRA (JP)
NAGAI AKIRA (JP)
Application Number:
PCT/JP2010/057604
Publication Date:
December 02, 2010
Filing Date:
April 28, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
OOKUBO KEISUKE (JP)
NAGAI AKIRA (JP)
OOKUBO KEISUKE (JP)
NAGAI AKIRA (JP)
International Classes:
H01L21/60; C09J7/22; C09J7/30; C09J11/06; C09J133/00; C09J163/00; C09J201/00; H01L21/301; H01L21/304; H01L21/56; H01L23/29; H01L23/31
Foreign References:
| JP2009027054A | 2009-02-05 | |||
| JP2005120206A | 2005-05-12 | |||
| JP2005028734A | 2005-02-03 | |||
| JP2008101183A | 2008-05-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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