Title:
ADHESIVE SHEET, ADHESIVE LIGHT SEMICONDUCTOR ELEMENT PRODUCTION METHOD AND OPTICAL SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/143623
Kind Code:
A1
Abstract:
The invention is an adhesive sheet provided with an adhesive layer that is used for direct or indirect adhesion onto an optical semiconductor element. A curve obtained by dynamic viscoelasticity measurements on the adhesive layer under the conditions of 1 Hz for the frequency and 20°C/minute for the rate of temperature rise, indicates the relationship between storage shear modulus G' and temperature T has a minimum value, the temperature T at the minimum value being in a range of 40°C to 200°C, and the storage shear modulus G' at the minimum value being in the range of 1,000 Pa to 90,000 Pa.
Inventors:
KONDO TAKASHI (JP)
EBE YUKI (JP)
AMANO YASUHIRO (JP)
EBE YUKI (JP)
AMANO YASUHIRO (JP)
Application Number:
PCT/JP2016/056397
Publication Date:
September 15, 2016
Filing Date:
March 02, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; C09J7/10; C09J11/02; C09J201/00; H01L33/50
Domestic Patent References:
WO2013121848A1 | 2013-08-22 |
Foreign References:
JP2013214716A | 2013-10-17 | |||
JP2011144360A | 2011-07-28 | |||
JP2007169519A | 2007-07-05 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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