Title:
ADHESIVE SHEET AND MANUFACTURING METHOD FOR SEMICONDUCTOR APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/125683
Kind Code:
A1
Abstract:
An adhesive sheet (10) according to the present invention comprises a first region (11) to which an adherend is bonded and a second region (12) provided on an outer periphery of the first region (11), wherein a tensile modulus of elasticity of the first region (11) is smaller than a tensile modulus of elasticity of the second region (12). The adhesive sheet (10) comprises a base film (13) and an adhesive layer (14) laminated on the base film (13), wherein the adherend is a plurality of semiconductor chips (CP), and wherein the first region (11) is provided in a central portion of the sheet in a planar view of the adhesive sheet (10).
Inventors:
SATO AKINORI (JP)
FUJIMOTO HIRONOBU (JP)
OKAMOTO NAOYA (JP)
YAMADA TADATOMO (JP)
MENJO TOSHIAKI (JP)
KAWASAKI KIMIHIKO (JP)
FUJIMOTO HIRONOBU (JP)
OKAMOTO NAOYA (JP)
YAMADA TADATOMO (JP)
MENJO TOSHIAKI (JP)
KAWASAKI KIMIHIKO (JP)
Application Number:
PCT/JP2016/052520
Publication Date:
August 11, 2016
Filing Date:
January 28, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/10; C09J7/20; C09J201/00; H01L21/301
Domestic Patent References:
| WO2014080918A1 | 2014-05-30 | |||
| WO2010058646A1 | 2010-05-27 |
Foreign References:
| JPH10242084A | 1998-09-11 | |||
| JP2013239595A | 2013-11-28 | |||
| JP2011061097A | 2011-03-24 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
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