Title:
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/105455
Kind Code:
A1
Abstract:
[Problem] The main purpose of the present invention is to provide an adhesive sheet which prevents scattering of chips during dicing and enables easy pick-up, while being not susceptible to leaving adhesive residue behind.
[Solution] An adhesive sheet which is obtained by laminating a photocurable adhesive layer on a base. The photocurable adhesive contains a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, a photopolymerization initiator and a tackifying resin. The tackifying resin is a completely or partially hydrogenated terpene phenol resin.
Inventors:
SAITO TAKESHI (JP)
TSUKUI TOMOYA (JP)
TSUKUI TOMOYA (JP)
Application Number:
PCT/JP2012/083954
Publication Date:
July 18, 2013
Filing Date:
December 27, 2012
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
C09J7/02; C09J4/00; C09J11/08; C09J133/06; C09J175/04; H01L21/301; H01L21/67; H01L21/683
Foreign References:
| JP2008103516A | 2008-05-01 | |||
| JP2007224258A | 2007-09-06 | |||
| JP2007291147A | 2007-11-08 |
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
Yoshitaka Sonoda (JP)
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