Title:
ADHESIVE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/133275
Kind Code:
A1
Abstract:
This adhesive sheet is formed of a resin composition that contains (A) a high molecular weight component, (B1) a thermosetting component that has a softening point of less than 50°C, (B2) a thermosetting component that has a softening point of from 50°C to 100°C (inclusive) and (C) a phenolic resin that has a softening point of 100°C or less. This adhesive sheet contains 11-22% by mass of (A) the high molecular weight component, 10-20% by mass of (B1) the thermosetting component that has a softening point of less than 50°C, 10-20% by mass of (B2) the thermosetting component that has a softening point of from 50°C to 100°C (inclusive) and 15-30% by mass of (C) the phenolic resin that has a softening point of 100°C or less, on the basis of 100% by mass of the resin composition.
Inventors:
KODAMA MEGUMI (JP)
TOKUYASU TAKAHIRO (JP)
IWAKURA TETSUROU (JP)
TOKUYASU TAKAHIRO (JP)
IWAKURA TETSUROU (JP)
Application Number:
PCT/JP2013/056002
Publication Date:
September 12, 2013
Filing Date:
March 05, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/10; C09J161/20; C09J201/00; H01L21/52
Foreign References:
| JP2008274259A | 2008-11-13 | |||
| JP2008074928A | 2008-04-03 | |||
| JP2011018806A | 2011-01-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims:
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