ADHESIVE SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, METHOD FOR MANUFACTURING THERMAL AIRFLOW SENSOR USING SAME, AND THERMAL AIRFLOW SENSOR

Title:

ADHESIVE SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, METHOD FOR MANUFACTURING THERMAL AIRFLOW SENSOR USING SAME, AND THERMAL AIRFLOW SENSOR

Document Type and Number:

WIPO Patent Application WO/2014/199726

Kind Code:

A1

Abstract:

Provided are: a thermal airflow meter having improved measurement accuracy; a method for manufacturing the thermal airflow meter; and an adhesive sheet for use in the thermal airflow meter. An adhesive sheet which is divided into at least two parts in accordance with an object to which the adhesive sheet is to be adhered and has a thickness of about 0.1 mm or less, said adhesive sheet being characterized in that the adhesive sheet is divided into parts in accordance with the shape of an object to which the adhesive sheet is to be adhered, and the adhesiveness or cohesiveness of the adhesive sheet can be developed or increased by the external irradiation with an energy.

Inventors:

IKEO SATOSHI (JP)
SAGAWA TOSHIFUMI (JP)
DOI RYOSUKE (JP)
KIKUCHI HIROSHI (JP)
MUKUNO HIDEKI (JP)

Application Number:

PCT/JP2014/061002

Publication Date:

December 18, 2014

Filing Date:

April 18, 2014

Export Citation:

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Assignee:

HITACHI AUTOMOTIVE SYSTEMS LTD (JP)

International Classes:

C09J7/20; C09J11/04; C09J201/00; G01F1/692; H01L21/02; H01L21/301; H01L21/52

Foreign References:

JP2001085360A	2001-03-30
JP2004266163A	2004-09-24
JPH0677316A	1994-03-18
JP2009036639A	2009-02-19
JP2009036641A	2009-02-19
JP2001085360A	2001-03-30

Other References: