Title:
ADHESIVE SHEET AND SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/018703
Kind Code:
A1
Abstract:
An adhesive sheet comprising a pressure−sensitive adhesive layer and a substrate layer, wherein the strength of adhesion between the pressure−sensitive adhesive layer and the substrate layer is controlled by means of irradiation with a radiation and the pressure−sensitive adhesive layer comprises the following ingredients: (a) a thermoplastic resin, (b) a heat−polymerizable ingredient, and (c) a compound which generates a base upon irradiation with the radiation. The adhesive sheet satisfies the following inconsistent requirements: it should have tackiness sufficient to keep semiconductor elements held thereon during dicing and, upon subsequent irradiation with a radiation for regulating the strength of adhesion between the pressure−sensitive adhesive layer and the substrate, come to have such low tackiness that it does not damage the elements during pickup.
Inventors:
KAWAKAMI HIROYUKI (JP)
INADA TEIICHI (JP)
MASUKO TAKASHI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YANAGAWA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
INADA TEIICHI (JP)
MASUKO TAKASHI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YANAGAWA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
Application Number:
PCT/JP2002/008616
Publication Date:
March 06, 2003
Filing Date:
August 27, 2002
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KAWAKAMI HIROYUKI (JP)
INADA TEIICHI (JP)
MASUKO TAKASHI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YANAGAWA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
KAWAKAMI HIROYUKI (JP)
INADA TEIICHI (JP)
MASUKO TAKASHI (JP)
OOKUBO KEISUKE (JP)
HATAKEYAMA KEIICHI (JP)
YANAGAWA TOSHIYUKI (JP)
KATOGI SHIGEKI (JP)
International Classes:
C09J7/22; C09J7/38; C09J163/00; H01L21/68; (IPC1-7): C09J7/02; C09J163/00
Foreign References:
JPS59188642A | 1984-10-26 | |||
JP2002180021A | 2002-06-26 | |||
JP2002226796A | 2002-08-14 | |||
JP2002226801A | 2002-08-14 |
Attorney, Agent or Firm:
Miyoshi, Hidekazu (Toranomon Daiichi Building 2-3, Toranomon 1-chom, Minato-ku Tokyo, JP)
Download PDF:
Previous Patent: METHOD FOR PRODUCING A LASER-PRINTABLE FILM
Next Patent: MOISTURE CROSS-LINKING ELASTIC COMPOSITION
Next Patent: MOISTURE CROSS-LINKING ELASTIC COMPOSITION