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Title:
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PRODUCTION AND SEMICONDUCTOR DEVICE PRODUCTION METHOD USING ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PRODUCTION
Document Type and Number:
WIPO Patent Application WO/2019/156253
Kind Code:
A1
Abstract:
The present invention provides: an adhesive sheet that, before a peeling step, stays fully and stably stuck to a back surface of a lead frame and a back surface of a sealing resin and does not leak sealing resin, even after being subjected to a QFN assembly thermal history, and that, during the peeling step, can be easily peeled away and does not leave an adhesive residue or break; and a semiconductor device production method that uses the adhesive sheet. An adhesive sheet for semiconductor device production. The adhesive sheet: comprises a base material and a thermosetting adhesive layer that is provided on one surface of the base material; and is to be peelably adhered to a lead frame or a wiring board of a semiconductor device. The adhesive layer contains a carboxyl-group-containing acrylonitrile/butadiene copolymer (a), an epoxy resin (b) that has structural formula (1), and a compound (c) that contains at least two maleimide groups, the remaining amount of unreacted maleimide being 0.02–0.13.

Inventors:
KONDOU YASUFUMI (JP)
FU WENFENG (JP)
MATSUNAGA YUUKI (JP)
Application Number:
PCT/JP2019/004810
Publication Date:
August 15, 2019
Filing Date:
February 12, 2019
Export Citation:
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Assignee:
TOMOEGAWA CO LTD (JP)
International Classes:
C09J109/02; C09J7/35; C09J163/00; C09J179/04; H01L21/56
Domestic Patent References:
WO2018143343A12018-08-09
Foreign References:
JP2008095014A2008-04-24
JP2016183237A2016-10-20
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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