Title:
ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2017/170437
Kind Code:
A1
Abstract:
This adhesive sheet for semiconductor processing comprises an adhesive layer on a substrate film and the 5% modulus of the substrate film is 7.0-20.0 MPa. The substrate film is a single layer and comprises 5-39 parts by mass of a styrene-based block copolymer with respect to 100 parts by mass of a base resin. The styrene-based block copolymer is at least one resin selected from among styrene-hydrogenated isoprene-styrene block copolymers, styrene-isoprene-styrene block copolymers, styrene-hydrogenated butadiene-styrene block copolymers, and styrene-hydrogenated isoprene/butadiene-styrene block copolymers. The base resin is at least one resin selected from among specific resins including polypropylene, polyethylene, and the like.
Inventors:
KAWATA SATORU (JP)
Application Number:
PCT/JP2017/012456
Publication Date:
October 05, 2017
Filing Date:
March 27, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J7/20; C09J133/00
Domestic Patent References:
| WO2011004825A1 | 2011-01-13 |
Foreign References:
| JP2007063340A | 2007-03-15 | |||
| JP2009170886A | 2009-07-30 | |||
| JP2014165473A | 2014-09-08 | |||
| JP2013098443A | 2013-05-20 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
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