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Patent Searching and Data


Title:
ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2018/092446
Kind Code:
A1
Abstract:
The invention provides an adhesive sheet for semiconductor processing including a substrate, an intermediate layer, and an adhesive layer, in this order, wherein the intermediate layer is a layer formed from an intermediate layer forming composition comprising a non-energy ray curable acrylic polymer (A) and an energy ray curable acrylic polymer (B) having a weight average molecular weight of 50000 to 250000, the adhesive layer is energy ray curable, and the elastic modulus difference at 23°C between the intermediate layer and the adhesive layer after energy ray cure is 20 MPa or less.

Inventors:
KAKIUCHI YASUHIKO (JP)
KOMASU YUICHIRO (JP)
Application Number:
PCT/JP2017/035971
Publication Date:
May 24, 2018
Filing Date:
October 03, 2017
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B32B7/02; B32B27/00; B32B27/30; C09J11/06; C09J133/06; C09J133/14; H01L21/301; H01L21/304
Domestic Patent References:
WO2015111310A12015-07-30
Foreign References:
JP2006128292A2006-05-18
JP2003173994A2003-06-20
JP2016192488A2016-11-10
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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