Title:
ADHESIVE SHEET FOR STEALTH DICING
Document Type and Number:
WIPO Patent Application WO/2018/083987
Kind Code:
A1
Abstract:
An adhesive sheet for stealth dicing, comprising a base material and an adhesive layer laminated on one surface side of the base material. The base material has a tensile elastic modulus of 50–450 MPa at 23°C. The adhesive layer comprises an energy ray-curable adhesive agent including an acrylic-based copolymer that includes, as a constituent monomer, an n–butyl acrylate, a 2–hydroxyethyl acrylate, and a (meth) acrylate alkyl ester having a C2 or lower alkyl group. Said adhesive sheet for stealth dicing has excellent solvent resistance and excellent heat shrinking properties.
Inventors:
YAMASHITA SHIGEYUKI (JP)
Application Number:
PCT/JP2017/037740
Publication Date:
May 11, 2018
Filing Date:
October 18, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J133/04; H01L21/683
Domestic Patent References:
| WO2015132852A1 | 2015-09-11 |
Foreign References:
| JP2008222781A | 2008-09-25 | |||
| JP2013100455A | 2013-05-23 | |||
| JP2011216508A | 2011-10-27 | |||
| JP2015151453A | 2015-08-24 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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