Title:
ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/037636
Kind Code:
A1
Abstract:
Provided is an adhesive sheet which is suitable for temporarily fixing an electronic component, includes an adhesive layer containing an acrylic adhesive, and has excellent characteristics at a high temperature. An adhesive sheet for temporarily fixing an electronic component according to the present invention includes an adhesive layer containing an acrylic adhesive, wherein the acrylic adhesive contains an acrylic polymer, and the coefficient of linear expansion of the adhesive layer at 200-210ºC is 1×10-5/K to 500×10-5/K. In one embodiment, the coefficient of linear expansion of the adhesive layer at 230-240ºC is 1×10-5/K to 500×10-5/K.
Inventors:
UENO SHUSAKU (JP)
KATO KAZUMICHI (JP)
HIRAYAMA TAKAMASA (JP)
KATO KAZUMICHI (JP)
HIRAYAMA TAKAMASA (JP)
Application Number:
PCT/JP2022/015754
Publication Date:
March 16, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J133/04; C09J7/38; H01L21/60
Foreign References:
| JP2011201983A | 2011-10-13 | |||
| JP2012149181A | 2012-08-09 | |||
| JP2014129491A | 2014-07-10 | |||
| JP2019199561A | 2019-11-21 | |||
| JP2004176032A | 2004-06-24 | |||
| JP2015021081A | 2015-02-02 | |||
| JP2015021083A | 2015-02-02 | |||
| JP2013181063A | 2013-09-12 | |||
| JP2021085021A | 2021-06-03 | |||
| JP2014173011A | 2014-09-22 | |||
| JP2015168711A | 2015-09-28 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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