Title:
ADHESIVE SHEET FOR WAFER PROCESSING
Document Type and Number:
WIPO Patent Application WO/2018/190085
Kind Code:
A1
Abstract:
This adhesive sheet 10 for wafer processing has a multilayer structure which comprises a substrate 11 that is composed of a polyolefin substrate containing a plasticizer and an adhesive layer 12 that contains a plasticizer. The content of the plasticizer in the adhesive layer 12 is, for example, 1-100 parts by mass relative to 100 parts by mass of the adhesive in the adhesive layer 12. This adhesive sheet for wafer processing is suitable for suppressing adhesion of dust to an object of the processing, said dust being generated during wafer dicing.
Inventors:
MIZUNO KOJI (JP)
TAKAHASHI TOMOKAZU (JP)
KAMEI KATSUTOSHI (JP)
TAKAHASHI TOMOKAZU (JP)
KAMEI KATSUTOSHI (JP)
Application Number:
PCT/JP2018/010950
Publication Date:
October 18, 2018
Filing Date:
March 20, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/301; C09J7/20; C09J11/06; C09J201/00
Foreign References:
| JP6075832B2 | 2017-02-08 | |||
| JP5977954B2 | 2016-08-24 | |||
| JP4845065B2 | 2011-12-28 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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