Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2011/155533
Kind Code:
A1
Abstract:
Disclosed is an adhesive sheet obtained by co-extruding an adhesive layer and a layer (a releasing layer) that can be released from the adhesive layer, wherein the base polymer of the adhesive layer is an acrylic polymer. Specifically disclosed is an adhesive sheet (10) which comprises: an intermediate layer (12) that contains an acrylic block copolymer as the base polymer and is adhesive at 23˚C; a releasing layer (14) that is laminated on a first surface (12A) of the intermediate layer (12) in a manner such that the releasing layer (14) can be released from the intermediate layer (12); and a non-releasing layer (16) that is laminated on a second surface (12B) of the intermediate layer (12) and cannot be released from the intermediate layer. The non-releasing layer (16) may be adhesive or non-adhesive at 23˚C.
Inventors:
TAKEDA, Kouhei (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
武田 公平 (〒80 大阪府茨木市下穂積1丁目1番2号 日東電工株式会社内 Osaka, 〒5678680, JP)
武田 公平 (〒80 大阪府茨木市下穂積1丁目1番2号 日東電工株式会社内 Osaka, 〒5678680, JP)
Application Number:
JP2011/063155
Publication Date:
December 15, 2011
Filing Date:
June 08, 2011
Export Citation:
Assignee:
NITTO DENKO CORPORATION (1-1-2, Shimohozumi Ibaraki-sh, Osaka 80, 〒5678680, JP)
日東電工株式会社 (〒80 大阪府茨木市下穂積1丁目1番2号 Osaka, 〒5678680, JP)
TAKEDA, Kouhei (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
日東電工株式会社 (〒80 大阪府茨木市下穂積1丁目1番2号 Osaka, 〒5678680, JP)
TAKEDA, Kouhei (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
International Classes:
C09J7/02; B32B27/00; B32B27/30; C09J133/04; C09J153/00
Attorney, Agent or Firm:
ABE Makoto (Kyodo Patent Law Firm, 47KT Bldg. 10th Floor, 3-20-3, Marunouchi, Naka-ku, Nagoya-sh, Aichi 02, 〒4600002, JP)
Claims:
Previous Patent: FLIP-FLOP CIRCUIT, SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Next Patent: ADHESIVE SHEET AND USE OF SAME
Next Patent: ADHESIVE SHEET AND USE OF SAME
