Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2014/069638
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive sheet which has antistatic performance, has a low coefficient of static friction in the sheet surface due to bleedout of an antistatic agent and has high semiconductor processability. [Solution] The adhesive sheet according to the present invention comprises a substrate film and an adhesive layer which is provided on the substrate film, wherein the substrate film is composed of an energy ray curable composition being formed into a film and cured, the composition including an energy ray curable resin and an ion liquid having ethylenically unsaturated bonds.
Inventors:
FUJIMOTO HIRONOBU (JP)
Application Number:
PCT/JP2013/079768
Publication Date:
May 08, 2014
Filing Date:
November 01, 2013
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C09J4/00; C09J7/25; C09J133/06
Foreign References:
| JP2011032397A | 2011-02-17 | |||
| JPH04216887A | 1992-08-06 | |||
| JP2010177542A | 2010-08-12 | |||
| JP2002210875A | 2002-07-31 | |||
| JP2010007017A | 2010-01-14 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
Maeda and a Suzuki international patent business corporation (JP)
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