Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2017/038918
Kind Code:
A1
Abstract:
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). A value found for the adhesive agent layer (12) by a die pull test with respect to silicon in a 100°C atmosphere is 3.0 N/die or greater.
Inventors:
TAKANO KEN (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
Application Number:
PCT/JP2016/075605
Publication Date:
March 09, 2017
Filing Date:
September 01, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; C09J133/08; C09J183/04; C09J201/00; H01L21/56
Foreign References:
| JP2011134811A | 2011-07-07 | |||
| JP2013168594A | 2013-08-29 | |||
| JP2012062373A | 2012-03-29 | |||
| JP2011129649A | 2011-06-30 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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