Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2017/038920
Kind Code:
A1
Abstract:
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12) including an adhesive agent. When the storage modulus of the adhesive agent layer (12) at 100°C is A (Pa) and the thickness of the adhesive agent layer (12) is B (m), a value calculated from the following relational expression (1) is 1.5×10-5 or greater: A×B2 (1).
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Inventors:
TAKANO KEN (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
KARASAWA YASUNORI (JP)
FUCHI EMI (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
KARASAWA YASUNORI (JP)
FUCHI EMI (JP)
Application Number:
PCT/JP2016/075607
Publication Date:
March 09, 2017
Filing Date:
September 01, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; C09J133/08; C09J183/04; C09J201/00; H01L21/56
Foreign References:
| JP2012059934A | 2012-03-22 | |||
| JP2004014930A | 2004-01-15 | |||
| JP2015130420A | 2015-07-16 | |||
| JP2015129226A | 2015-07-16 | |||
| JP2005220356A | 2005-08-18 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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