Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/092904
Kind Code:
A1
Abstract:
Provided is an adhesive sheet that has a support substrate and achieves both low initial adhesion and strong in-use adhesion. The adhesive sheet provided by this application includes a support substrate and an adhesive layer that is laminated on at least one side of the support substrate. The thickness of the adhesive layer is at least 3 μm but less than 100 μm. The thickness of the support substrate is at least 30 μm. The relationship between the elastic modulus Et' [MPa] of the adhesive sheet and the thickness Ts [mm] of the support substrate satisfies the expression 0.1 [N∙mm] < Et'× (Ts)3. The adhesive force N2 of the adhesive sheet after the adhesive layer has been stuck to a stainless steel plate (an SUS304BA plate) and then heated for 5 minutes at 80°C is at least 20 times the adhesive force N1 of the adhesive sheet after the adhesive layer has been stuck to a stainless steel plate (an SUS304BA plate) and then left for 30 minutes at 23°C.
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Inventors:
IEDA HIROKI (JP)
SUZUKI TATSUYA (JP)
FURUTA KENJI (JP)
WATANABE MINAMI (JP)
NAKANO TAKESHI (JP)
SASAKI SHOGO (JP)
SUZUKI TATSUYA (JP)
FURUTA KENJI (JP)
WATANABE MINAMI (JP)
NAKANO TAKESHI (JP)
SASAKI SHOGO (JP)
Application Number:
PCT/JP2017/041673
Publication Date:
May 24, 2018
Filing Date:
November 20, 2017
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J11/08; C09J133/00; C09J201/00
Domestic Patent References:
| WO2015190441A1 | 2015-12-17 | |||
| WO2015163115A1 | 2015-10-29 | |||
| WO2016021332A1 | 2016-02-11 |
Foreign References:
| JP2014224227A | 2014-12-04 | |||
| JP2016079232A | 2016-05-16 | |||
| JP2012184369A | 2012-09-27 |
Attorney, Agent or Firm:
OI, Michiko (JP)
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