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Patent Searching and Data


Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/181770
Kind Code:
A1
Abstract:
Provided is an adhesive sheet comprising: a non-adhesive thermally expandable substrate containing a resin and thermally expandable particles that have an expansion start temperature (t) of 120-250°C; and an adhesive layer containing an adhesive resin. The thermally expandable substrate satisfies the requirements (1) and (2) indicated below. Requirement (1): the storage elastic modulus E'(23) of the thermally expandable substrate at 23°C is 1.0 × 106 Pa or more. Requirement (2): the storage elastic modulus E'(t) of the thermally expandable substrate at the expansion start temperature (t) of the thermally expandable particles is 1.0 × 107 Pa or less.

Inventors:
AKUTSU TAKASHI (JP)
KATO KIICHIRO (JP)
Application Number:
PCT/JP2018/013357
Publication Date:
October 04, 2018
Filing Date:
March 29, 2018
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/22; C08J5/18
Domestic Patent References:
WO2016076131A12016-05-19
Foreign References:
JP2006291137A2006-10-26
JP2000248240A2000-09-12
JP2002322359A2002-11-08
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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