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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2019/172218
Kind Code:
This adhesive sheet (10) comprises a substrate (11) and an adhesive layer (12), the adhesive layer (12) has a Young's modulus of less than 1.0 × 105 (Pa), and said adhesive sheet (10) is characterized in that the stress increase rate as calculated by the mathematical formula (mathematical formula 1) indicated below is less than 25% when the stress of the adhesive layer (12) at 100% strain is denoted by SA (Pa) and the stress at 300% strain is denoted by SB (Pa). Mathematical formula 1: stress increase rate (%) = {(SB – SA)/SA} × 100.

INAO Youichi (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
OKAMOTO Naoya (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
YAMADA Tadatomo (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
Publication Date:
September 12, 2019
Filing Date:
March 05, 2019
Export Citation:
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LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
International Classes:
C09J7/38; C09J7/25; C09J133/00; C09J175/04; H01L21/301; H01L21/683
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (3rd Floor, 26-13 Ogikubo 5-chome, Suginami-k, Tokyo 51, 〒1670051, JP)
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