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Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/172220
Kind Code:
A1
Abstract:
This adhesive sheet (10) comprises a substrate (11) and an adhesive layer (12) and is characterized in that the stress increase rate as calculated by the mathematical formula (mathematical formula 1) indicated below is less than 25% when the stress of the adhesive layer (12) at 100% strain is denoted by SA (Pa) and the stress at 300% strain is denoted by SB (Pa). Mathematical formula 1: stress increase rate (%) = {(SB – SA)/SA} × 100.

Inventors:
INAO Youichi (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
OKAMOTO Naoya (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
YAMADA Tadatomo (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
JP2019/008513
Publication Date:
September 12, 2019
Filing Date:
March 05, 2019
Export Citation:
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
International Classes:
C09J7/38; C09J7/25; C09J133/00; C09J175/04; H01L21/301; H01L21/683
Domestic Patent References:
WO2018003312A12018-01-04
WO2012124389A12012-09-20
Foreign References:
JP2007245389A2007-09-27
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (3rd Floor, 26-13 Ogikubo 5-chome, Suginami-k, Tokyo 51, 〒1670051, JP)
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