Title:
ADHESIVE TAPE, ARTICLE, AND ARTICLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/123615
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an adhesive tape: that possesses superior adhesiveness before being heated; that can be expanded by being heated; and that is capable of exhibiting superior adhesiveness even after being heated and expanded. The present invention is an adhesive tape that is used for the purpose of filling a gap that an adherend (C1) has or a gap between an adherend (C1) and an adherend (C2), the adhesive tape being characterized in that the adhesive tape includes a thermoplastic heat-expandable adhesive layer (A), and that the rate of expansion of the thermoplastic heat-expandable adhesive layer (A) in a thickness direction, that is, ([thickness of thermoplastic heat-expandable adhesive layer (A1) after being heated]/[thickness of thermoplastic heat-expandable adhesive layer (A) before being heated])×100, is equal to or greater than 150%.
Inventors:
KARASAWA KUMIKO (JP)
AKIYAMA SEIJI (JP)
MORINO AKINORI (JP)
AKIYAMA SEIJI (JP)
MORINO AKINORI (JP)
Application Number:
PCT/JP2017/044867
Publication Date:
July 05, 2018
Filing Date:
December 14, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J7/00; B32B7/10; C09J11/06; C09J201/00
Domestic Patent References:
| WO2012111507A1 | 2012-08-23 | |||
| WO2015138881A2 | 2015-09-17 |
Foreign References:
| JPH05311134A | 1993-11-22 | |||
| JPS58204075A | 1983-11-28 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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