Title:
ADHESIVE TAPE FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/057519
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, characterized in that a metal layer 1, a first adhesive layer 3, an insulation layer 5, and a second adhesive layer 7 are layered therein in this order, the thickness of the metal layer 1 is 200 µm or less, and the storage modulus of the first adhesive layer 3 at 200°C after heat treatment for 1 hour at 175°C is 1×106 Pa or greater.
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| JP3065664 | [Title of Invention] Multilayer tube |
Inventors:
SHIMIZU YUKI (JP)
ICHIKAWA TAKAMASA (JP)
ICHIKAWA TAKAMASA (JP)
Application Number:
PCT/JP2016/078733
Publication Date:
April 06, 2017
Filing Date:
September 28, 2016
Export Citation:
Assignee:
TOMOEGAWA CO LTD (JP)
International Classes:
B32B15/08; B32B27/00; C09J7/20; C09J179/08; C09J201/00; H01L21/60
Foreign References:
| JPH07235626A | 1995-09-05 | |||
| JPH0693238A | 1994-04-05 | |||
| JP2000008020A | 2000-01-11 | |||
| JPH06345964A | 1994-12-20 | |||
| JP2009001793A | 2009-01-08 | |||
| JP2003188334A | 2003-07-04 | |||
| JP2003253220A | 2003-09-10 | |||
| JP2003332510A | 2003-11-21 | |||
| JPH05179210A | 1993-07-20 | |||
| JP2003249617A | 2003-09-05 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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