Title:
ADHESIVE TAPE, JOINT STRUCTURE, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2008/023452
Kind Code:
A1
Abstract:
Disclosed is an adhesive tape (101) for electrically connecting conductive
members to each other. The adhesive tape (101) comprises a resin layer (132)
containing a thermocurable resin, a solder powder (103), and a curing agent.
The solder powder (103) and the curing agent are present in the resin layer (132),
the curing temperature (T1) of the resin layer (132) and the melting
point (T2) of the solder powder (103) meet the requirement expressed
by the following formula: T1 ≥ T2+20˚C, and
the melt viscosity of the resin layer (132) at the melting point (T2)
of the solder powder (103) ranges from 50 to 5000 Pa s inclusive.
Inventors:
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
MIYAMOTO TETSUYA (JP)
YAMASHIRO TOMOE (JP)
MIYAMOTO TETSUYA (JP)
Application Number:
PCT/JP2007/000457
Publication Date:
February 28, 2008
Filing Date:
April 25, 2007
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
MIYAMOTO TETSUYA (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
MIYAMOTO TETSUYA (JP)
International Classes:
C09J7/35; C09J9/02; C09J11/04; C09J163/00; C09J163/02; C09J201/00; H01L21/60
Foreign References:
| JP2005194306A | 2005-07-21 | |||
| JP2005276925A | 2005-10-06 | |||
| JP2004292821A | 2004-10-21 | |||
| JP2003128874A | 2003-05-08 | |||
| JP2004288814A | 2004-10-14 | |||
| JP2004349495A | 2004-12-09 | |||
| JP2004186204A | 2004-07-02 | |||
| JPS61276873A | 1986-12-06 | |||
| JP2004260131A | 2004-09-16 | |||
| JPH04262890A | 1992-09-18 |
Attorney, Agent or Firm:
HAYAMI, Shinji (2-17-16 Ebisu-Nishi, Shibuya-k, Tokyo 21, JP)
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