ADHESIVE TAPE MANUFACTURING METHOD AND ADHESIVE TAPE

WIPO Patent Application WO/2010/071207

A1

Provided is an adhesive tape manufacturing method with which it is possible, merely by performing a simple step, to ensure that adhesive does not remain on the portion not having an adhesive layer when a pattern of an adhesive layer of a prescribed shape is formed on a support. Disclosed is an adhesive tape manufacturing method whereby a pattern is formed on a support by an adhesive layer and a non-adhesive layer and which performs at least: an adhesive application step wherein the adhesive is applied to the first face of a sheet that has a through-hole with a shape identical to that of the aforementioned non-adhesive layer; an adhesive-removal sheet first lamination step wherein an adhesive-removal sheet is laminated on the second face, which is the reverse face of the first face of the aforementioned sheet; and an adhesive transfer step wherein, after at least the aforementioned adhesive application step and the aforementioned adhesive-removal sheet first lamination step have been performed, the support is laminated to the first face of the aforementioned sheet and the adhesive is transferred to said support.

KASE KENZO (JP)
TAKEDA YUKARI (JP)
KASE TOMOKO (US)

PCT/JP2009/071179

June 24, 2010

December 18, 2009

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KINESIO IP LLC (US)
KASE KENZO (JP)
TAKEDA YUKARI (JP)
KASE TOMOKO (US)

A61K9/70; A61L15/58; C09J7/22; C09J7/38; A61F13/02

JP2004099807A	2004-04-02
JPH0525440A	1993-02-02
JPH05301325A	1993-11-16
JPH11349903A	1999-12-21

WATANABE KAORU (JP)
Kaoru Watanabe (JP)

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