Title:
ADHESIVE TAPE FOR MOLD RELEASE
Document Type and Number:
WIPO Patent Application WO/2016/174713
Kind Code:
A1
Abstract:
An adhesive tape for mold release, the adhesive tape having at least a fluorine resin film 1, which constitutes a mold-release surface, and an adhesive layer 2 and, as desired, having an application tape 3 and a peel-off liner 4. The adhesive tape is characterized in that the adhesive layer 2 comprises an adhesive composition that has a type OO durometer hardness, as defined by ASTM D2240, of 60 or higher at 23°C and of 30 or higher at 150°C. Rough marks are not left on the mold-release surface of the tape even if the tape is hot pressed at high-temperatures, and molded articles that have a favorable appearance can be obtained even if the articles are molded continuously.
Inventors:
TSUCHIYA YASUSHI (JP)
IWAMOTO TAROU (JP)
IWAMOTO TAROU (JP)
Application Number:
PCT/JP2015/062691
Publication Date:
November 03, 2016
Filing Date:
April 27, 2015
Export Citation:
Assignee:
TERAOKA SEISAKUSHO KK (JP)
International Classes:
B29C33/68
Foreign References:
| JP2011157476A | 2011-08-18 | |||
| JPH09241607A | 1997-09-16 |
Attorney, Agent or Firm:
ISHIBASHI, Masayuki et al. (JP)
Masayuki Ishibashi (JP)
Masayuki Ishibashi (JP)
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