Title:
ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER ETC.
Document Type and Number:
WIPO Patent Application WO/2012/133418
Kind Code:
A1
Abstract:
The issue of the present invention is to provide an adhesive tape for processing semiconductor wafers and the like, with which a quantity of an adhesive left on the surface of a material that has had a tape adhered thereon can be sufficiently reduced after the tape is peeled. An adhesive tape (100) for processing semiconductor wafers and the like is provided with a base material layer (200), and an adhesive layer (300). The adhesive layer (300) is formed at least on one surface of the base material layer (200). Furthermore, the adhesive layer (300) is mainly composed of a carboxyl group-containing polymer. The carboxyl group-containing polymer contains a radiation polymerizable compound (specifically, urethaneacrylate).
Inventors:
ISHIBA AKIHIRO (JP)
ISOBE MASATOSHI (JP)
NAGAO YOSHINORI (JP)
ISOBE MASATOSHI (JP)
NAGAO YOSHINORI (JP)
Application Number:
PCT/JP2012/057952
Publication Date:
October 04, 2012
Filing Date:
March 27, 2012
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
ISHIBA AKIHIRO (JP)
ISOBE MASATOSHI (JP)
NAGAO YOSHINORI (JP)
ISHIBA AKIHIRO (JP)
ISOBE MASATOSHI (JP)
NAGAO YOSHINORI (JP)
International Classes:
C09J7/02; C09J4/00; C09J175/14; C09J201/08; H01L21/301
Foreign References:
| JP2007291147A | 2007-11-08 | |||
| JP2009246302A | 2009-10-22 | |||
| JP2008013692A | 2008-01-24 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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Claims: