Title:
ADHESIVE TAPE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/181403
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive tape capable of stably holding chips, etc., even when dry polishing is performed following pre-dicing.
[Solution] An adhesive tape used applied to the surface of a semiconductor wafer in a process in which the rear surface of a semiconductor wafer having grooves formed on the surface thereof is ground, the semiconductor wafer is separated into individual semiconductor chips as a result of the grinding, and dry polishing is performed. The adhesive tape includes a base material and an adhesive layer provided on one surface of the base material. The tensile storage modulus of the base material at 60ºC is at least 250 MPa.
Inventors:
KAKIUCHI YASUHIKO (JP)
MAEDA JUN (JP)
NISHIDA TAKUO (JP)
MAEDA JUN (JP)
NISHIDA TAKUO (JP)
Application Number:
PCT/JP2019/007550
Publication Date:
September 26, 2019
Filing Date:
February 27, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; B32B27/00; C09J7/38; H01L21/301; H01L21/304
Domestic Patent References:
| WO2012026431A1 | 2012-03-01 | |||
| WO2017150676A1 | 2017-09-08 |
Foreign References:
| JP2005183764A | 2005-07-07 | |||
| JP2008270282A | 2008-11-06 | |||
| JP2006080329A | 2006-03-23 | |||
| JP2005347382A | 2005-12-15 | |||
| JP2017005072A | 2017-01-05 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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