Title:
ADHESIVE TAPE FOR PROTECTING SEMICONDUCTOR WAFER SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2016/056269
Kind Code:
A1
Abstract:
Provided is an adhesive tape for protecting a semiconductor wafer surface having bumps, said adhesive tape having an ultraviolet curable adhesive layer on a substrate film, wherein the adhesive layer comprises a (meth)acrylic polymer having a weight average molecular weight of 10,000 to 2,000,000 and a radiation curable carbon-carbon double bond-containing group, a hydroxyl group and a carboxy group; the surface free energy of the adhesive layer surface before ultraviolet irradiation is at least 25.5 mN/m and less than 35 mN/m; the surface of the adhesive layer after having been cured with ultraviolet irradiation has a surface free energy that is at least 5 mN/m higher than that of the surface of the adhesive layer before ultraviolet irradiation and has a small contact angle with respect to diiodomethane; the polymer constituting the adhesive layer surface having a hydroxyl value of 30-100 mg KOH/g; and the polymer constituting the adhesive layer surface has an acid value of 5-65 mg KOH/g. Also provided is a method for processing a semiconductor wafer having bumps.
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Inventors:
YOKOI HIROTOKI (JP)
UCHIYAMA TOMOAKI (JP)
UCHIYAMA TOMOAKI (JP)
Application Number:
PCT/JP2015/062946
Publication Date:
April 14, 2016
Filing Date:
April 30, 2015
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J4/00; C09J7/20; C09J133/00; H01L21/304
Domestic Patent References:
| WO2014126096A1 | 2014-08-21 | |||
| WO2013061931A1 | 2013-05-02 |
Foreign References:
| JP2014175334A | 2014-09-22 | |||
| JP2009224621A | 2009-10-01 | |||
| JP2010129700A | 2010-06-10 | |||
| JP2014116431A | 2014-06-26 | |||
| JP2014154704A | 2014-08-25 | |||
| JP2013213075A | 2013-10-17 | |||
| JP2010129701A | 2010-06-10 | |||
| JP5718515B1 | 2015-05-13 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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