Title:
ADHESIVE TAPE FOR PROTECTING SURFACE OF SEMICONDUCTOR COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/099158
Kind Code:
A1
Abstract:
In order to provide a surface protection adhesive tape, with which less foreign material is transferred, in semiconductor component manufacturing steps, to a subject (component) having the tape adhered thereon, an adhesive tape is configured of at least a base material film, an adhesive layer, and a peeling liner. The surface protection adhesive tape has the adhesive layer on one surface of the base material film, and on the adhesive layer, the peeling liner using an unprocessed plastic film not including a mold release layer is formed.
Inventors:
FUKUHARA Junji (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
福原 淳仁 (〒80 大阪府茨木市下穂積一丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
福原 淳仁 (〒80 大阪府茨木市下穂積一丁目１番２号 日東電工株式会社内 Osaka, 〒5678680, JP)
Application Number:
JP2012/050949
Publication Date:
July 26, 2012
Filing Date:
January 18, 2012
Export Citation:
Assignee:
NITTO DENKO CORPORATION (1-1-2, Shimohozumi Ibaraki-sh, Osaka 80, 〒5678680, JP)
日東電工株式会社 (〒80 大阪府茨木市下穂積一丁目１番２号 Osaka, 〒5678680, JP)
FUKUHARA Junji (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
日東電工株式会社 (〒80 大阪府茨木市下穂積一丁目１番２号 Osaka, 〒5678680, JP)
FUKUHARA Junji (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
International Classes:
C09J7/02; B32B27/00; B32B27/36
Attorney, Agent or Firm:
HASEBE Zentaro et al. (Hatsumei-Kaikan Bldg. 5F, 2-9-14 Toranomon Minato-k, Tokyo 01, 〒1050001, JP)
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Claims: