ADHESIVE TAPE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Title:

ADHESIVE TAPE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2007/125650

Kind Code:

A1

Abstract:

Disclosed is an adhesive tape for electrically connecting conductive members to each other. The adhesive tape comprises a resin, a solder powder and a curing agent having a flux activity, wherein the solder powder and the curing agent are present in the resin.

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Inventors:

KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
MIYAMOTO TETSUYA (JP)

Application Number:

PCT/JP2007/000447

Publication Date:

November 08, 2007

Filing Date:

April 24, 2007

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
MIYAMOTO TETSUYA (JP)

International Classes:

C09J7/35; C09J9/02; C09J11/04; C09J11/06; C09J133/00; C09J163/00; C09J163/02; C09J163/04; C09J201/00; H01L25/065; H01L25/07; H01L25/18

Foreign References:

JP2005194306A	2005-07-21
JP2005276925A	2005-10-06
JP2004292821A	2004-10-21
JP2003128874A	2003-05-08
JP2004288814A	2004-10-14
JP2004349495A	2004-12-09
JP2004186204A	2004-07-02
JPS61276873A	1986-12-06
JP2004260131A	2004-09-16

Attorney, Agent or Firm:

HAYAMI, Shinji (2-17-16 Ebisu-Nishi,Shibuya-k, Tokyo 21, JP)

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