Title:
ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/150676
Kind Code:
A1
Abstract:
This adhesive tape for semiconductor processing is used by attaching said adhesive tape to the surface of a semiconductor wafer in a step in which the rear surface of a semiconductor wafer having a groove or a modified area formed on the semiconductor wafer surface thereof is ground and the semiconductor wafer is separated into individual semiconductor chips by the grinding. The adhesive tape for semiconductor processing is provided with a substrate, a buffer layer provided on one surface of the substrate, and an adhesive layer provided on the other surface of the substrate. The overall tape thickness of the adhesive tape for semiconductor processing is 160 µm or less, the ratio (D2/D1) of the thickness (D2) of the buffer layer with respect to the thickness (D1) of the substrate is 0.7 or less, and the peel strength with respect to a semiconductor wafer is 1000 mN/50 mm or less.
Inventors:
TOMINAGA TOMOCHIKA (JP)
HORIGOME KATSUHIKO (JP)
HORIGOME KATSUHIKO (JP)
Application Number:
PCT/JP2017/008314
Publication Date:
September 08, 2017
Filing Date:
March 02, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J7/20; C09J133/04; H01L21/304
Domestic Patent References:
| WO2015156389A1 | 2015-10-15 |
Foreign References:
| JP2005343997A | 2005-12-15 | |||
| JP2008214386A | 2008-09-18 | |||
| JP2003273042A | 2003-09-26 | |||
| JP2015183008A | 2015-10-22 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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