Title:
ADHESIVE TAPE FOR SEMICONDUCTOR WAFER PROCESSING
Document Type and Number:
WIPO Patent Application WO/2016/148110
Kind Code:
A1
Abstract:
The present invention provides an adhesive tape for semiconductor processing, which does not leave adhesive residue when the adhesive tape for semiconductor processing is removed from a wafer surface after back polishing, especially in a back grinding step of a silicon wafer or the like.
An adhesive tape for semiconductor wafer processing 1 according to the present invention comprises a base film 2 and an energy ray-curable adhesive layer 3 that is provided on one surface of the base film 2, and is characterized in that if A (N/25 mm) is the adhesive power thereof before irradiation of an energy ray, T (KPa) is the tackiness thereof before irradiation of an energy ray, E (mm) is the elongation thereof before irradiation of an energy ray, AUV (N/25 mm) is the adhesive power thereof after irradiation of an energy ray, TUV (KPa) is the tackiness thereof after irradiation of an energy ray, and EUV (mm) is the elongation thereof after irradiation of an energy ray, A, T, E, AUV, TUV and EUV satisfy AUV/A ≤ 0.3, TUV/T ≤ 0.05 and EUV/E ≤ 0.3.
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Inventors:
UCHIYAMA TOMOAKI (JP)
Application Number:
PCT/JP2016/058005
Publication Date:
September 22, 2016
Filing Date:
March 14, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/304; C09J4/00; C09J5/00; C09J7/20; C09J201/00
Foreign References:
| JP2014015521A | 2014-01-30 | |||
| JP2004186429A | 2004-07-02 | |||
| JP2006156754A | 2006-06-15 | |||
| JP2007012670A | 2007-01-18 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
Matsushita 亮 (JP)
Matsushita 亮 (JP)
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