Title:
ADHESIVE TAPE WITH EXCELLENT HEAT RESISTANCE
Document Type and Number:
WIPO Patent Application WO/2023/048053
Kind Code:
A1
Abstract:
Provided is an adhesive tape with excellent heat resistance. The adhesive tape comprises a vinyl chloride resin-based base material (A) and an adhesive layer (B) laminated onto at least one side of the base material (A). The base material (A) and the adhesive layer (B) contain the same plasticizer (a), and a heating mass reduction rate of the plasticizer (a) after heating at 200ºC for 60 minutes is 1 mass% or less. A content percentage (W1) of the plasticizer (a) in the base material (A) is 25-35 mass%, and a content percentage (W2) of the plasticizer in the adhesive layer (B) and the content percentage (W1) satisfy expression (1) below. (1): |W2 – W1| ≤ 5 mass%
Inventors:
ARAMOTO KAHO (JP)
MIURA MANABU (JP)
YOSHIMURA DAISUKE (JP)
MIURA MANABU (JP)
YOSHIMURA DAISUKE (JP)
Application Number:
PCT/JP2022/034493
Publication Date:
March 30, 2023
Filing Date:
September 15, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J7/24; B32B27/00; B32B27/22; B32B27/30; C08K5/10; C08L27/06; C08L91/00; C09J7/38; C09J11/06; C09J11/08; C09J201/00
Domestic Patent References:
| WO2018225541A1 | 2018-12-13 |
Foreign References:
| JP2017212249A | 2017-11-30 | |||
| JP2011032324A | 2011-02-17 | |||
| JP2016524632A | 2016-08-18 | |||
| JP2008195927A | 2008-08-28 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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